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Newest first · page 1 of 7Chips & deep techArticleSamsung Electronics Bets on Packaging at Onyang, Boosting HBM and FoundrySamsung Electronics is reportedly strengthening its chip packaging business in Onyang, South Korea, to boost both its HBM and foundry competitiveness.Chip industry news AIArticleGoogle Expands AI Chip Lineup to Four; Samsung and SK Accelerate Custom MemoryGoogle unveiled the security-focused TPU '8tx' and the long-context TPU '8i Max', bringing its 8th-generation TPU lineup to four models. TPUs are AI chips Google designs. The high-bandwidth memory (HBM, fast memory attached to chips) that goes with each chip also varies by use.AI news 
Chips & deep techArticleTSMC May Start Producing Advanced Memory Chips Itself, Report SaysTSMC, the world's largest contract chipmaker, is reportedly considering making more advanced memory chips. Reuters reported on the 8th, citing the IT outlet The Information. TSMC is looking at this move to win a bigger share of the artificial intelligence (AI) hardware market.Chip industry news 
Chips & deep techArticleTSMC Reportedly Considering Direct Production of Advanced Memory Chips for AIA report says TSMC, the world's largest contract chipmaker, is considering increasing production of advanced memory for AI chips. Reuters reported this, citing the IT outlet The Information. Since it is still at the review stage, it is unclear whether it will lead to actual investment or mass production.Chip industry news Chips & deep techArticleNvidia Asks TSMC to Produce 3D DRAM, Possibly Shaking Up the Memory MarketNvidia has reportedly asked TSMC, the world's largest contract chipmaker, to produce next-generation 3D DRAM. As the prices of high-bandwidth memory (HBM, memory that stacks multiple layers of DRAM to move data quickly) rise and supply runs short, the move appears aimed at reducing Nvidia's reliance on existing memory makers.Chip industry news 
AIArticleChip Industry Week In ReviewThis week, the biggest chip industry news was that Nvidia's board has started an internal review of CEO Jensen Huang. Reports also revealed routes used to smuggle AI chips and high-bandwidth memory (HBM) to China. There was also news that Micron has halted construction of a plant in Taiwan and that Samsung plans to expand HBM production.Semiconductor Engineering 
Chips & deep techOfficialFive Ways NVIDIA Co-Design Maximizes the Value of Every Byte in the AI FactoryIn data centers that run AI services, how usefully companies use high-bandwidth memory (HBM, fast memory attached next to the GPU) has become important, because it is fast but expensive and scarce. NVIDIA says it is solving this problem by designing chips, software, CPUs, and storage together.NVIDIA Technical blog Chips & deep techArticleSamsung Wins AMD's HBM4 Base Die Deal Over TSMC at Taylor Fab 2Samsung Electronics will make the base die for AMD's next-generation HBM4 memory at its Taylor Fab 2 in the United States. Reports say Samsung gained this deal by stepping into a gap left by the earlier partnership between SK hynix and TSMC, which lasted through HBM3E.Chip industry news 
Chips & deep techArticleSamsung to Make HBM Base Dies in Texas as It Targets Big Tech Customers Seeking TSMC AlternativesSamsung Electronics plans to produce base dies, the bottom chips of HBM (high-performance memory made by stacking several DRAM chips), at its Taylor Fab 2 in Texas. The goal is to supply customers such as AMD. However, analysts say Samsung could lose its leading position in the domestic industry if Nvidia has its base dies made by TSMC.Chip industry news 
Chips & deep techArticleGlobal Chip Equipment Makers Add 2,500 Korean Workers in Three YearsAs Samsung Electronics and SK hynix expand investment in high-bandwidth memory (HBM, a high-performance memory that stacks layers to move data quickly) and advanced DRAM, the local workforce of chip equipment companies has also grown sharply. The three companies ASML, Lam Research, and Tokyo Electron have a combined 7,800 employees in Korea this year.Chip industry news 
Chips & deep techArticle멜콘, 세계 최첨단 반도체 노광장비 공급망 선점…High-NA EUV 상용화 이어 HBM 후공정 진출 - 파이낸셜포스트Chip industry newsOpens the source site 
Chips & deep techArticle이제 반도체도 맞춤 제작! ‘커스텀 HBM’ 뜬다 - 조선일보Chip industry newsOpens the source site 
Chips & deep techArticle이상일 용인시장, ASML 찾아 HBM장비 적기 공급 요청 - 동행미디어 시대Chip industry newsOpens the source site 
Chips & deep techArticle앤트로픽 "메모리 3사, HBM 수요 못 따라가 …TSMC 집중도 위험" - 중앙신문Chip industry newsOpens the source site 
Chips & deep techArticle앤트로픽 "메모리 3사 HBM 병목…TSMC 집중도 위험요인" - 연합뉴스Chip industry newsOpens the source site 
Chips & deep techArticleHBM까지 넘보는 중국…K반도체 초격차 무너지나 - 이코노미스트Chip industry newsOpens the source site 
Chips & deep techArticle맞춤형 HBM 시대 본격 개막...반도체 ‘적과의 동침’ ‘합종연횡’ 가속화 - 조선일보Chip industry newsOpens the source site Chips & deep techArticle위기 딛고 HBM4 승부수…삼성 반도체 초격차 재건 [이재용 4년, 미래 지도] - 이투데이Chip industry newsOpens the source site 
Chips & deep techArticle"HBM 잘 팔려도 안심 못 한다"…삼성전자가 TSMC에 내줄 수 없는 핵심 시장 - 뉴시스Chip industry newsOpens the source site 