TSMC Considers 3D DRAM at Nvidia's Request, Potentially Challenging Samsung and SK Hynix

At a glance

TSMC, the world's largest contract chipmaker, is considering producing 3D DRAM, a next-generation memory, at the request of Nvidia. If it goes ahead, it would add a new competitor to a memory market led by Samsung Electronics, SK Hynix, and Micron.

Key points

1. 1

   3D DRAM is a technology that stacks memory chips upward instead of laying them flat, which increases storage capacity.

2. 2

   DRAM prices have risen sharply, and growing demand for AI chips is pushing chip designers such as Nvidia to look for new suppliers.

3. 3

   TSMC is considering building new factories or acquiring existing ones, but the investment size and mass production timing have not been decided.

4. 4

   TSMC has not responded to market rumors and said it will focus on its core foundry business.

Why it matters

Memory prices and supply can affect the prices of smartphones, laptops, and AI services, so this change is connected to everyday life.